SK hynix bets $4B on US HBM by 2029

SK hynix broke ground on a more-than-$4 billion advanced-packaging facility in Indiana that targets its first U.S. HBM mass production in the second half of 2029. The company says the cleanroom should open by October 2028, the site will employ about 1,000 people, and the broader supplier ecosystem could support 7,000 jobs, according to its Indiana HBM facility announcement. That matters less as a jobs release than as a supply-chain signal: the wafers will still be made in Korea and packaged in the United States, a split architecture builders should track alongside the new economics of Rubin-scale AI infrastructure.