Samsung commits $3.14B to AI-server substrates

Samsung Electro-Mechanics will spend $3.14 billion (4.27 trillion won) through May 2028 to expand FC-BGA substrate capacity in Sejong for AI servers. Its investment report says new lines are scheduled for mass production in September 2028, while Samsung’s package-substrate briefing shows the component connects high-performance chips to servers and accelerators. For AI infrastructure builders, accelerator supply is also a packaging queue: Broadcom’s AI supply expansion points upstream, where substrate lead times can decide delivery.